Low Temperature Curable Low Dk & Df Polyimide for Redistribution Layer

نویسندگان

چکیده

In this paper, we report low temperature curable (around 200～250℃), Dk (2.7) and Df (0.007) negative tone type photo-definable polyimides. Those materials, which were in states of liquid or B-stage sheet, able to be patterned by photolithography process. Our novel polyimides showed excellent dielectric mechanical properties, good results on reliability tests. developed kept enough insulating performance after a biased HAST (High Accelerated Stress Test). Finally, collaboration with IME, test package mounted our polyimide as redistribution layers was fabricated.

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